Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef
Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea
Electronics Forum | Mon Nov 15 14:40:38 EST 1999 | Bob Smith
Hi, I have a problem I've never seen before so I hope someone here can help. A recent batch of PCBs arrived where the copper lands delaminate with a small pull. Normally you have to pull pretty hard and the whole land comes off the substrate. These
Electronics Forum | Thu May 23 17:12:31 EDT 2019 | smith88
What criteria do you all use when you have a dropped populated PCB and why. Thanks
Electronics Forum | Fri Dec 09 06:25:53 EST 2005 | ajay
thanks for info Most of the defect soldering joint do not take place. Observe that PCB not cleaned properly & also component wetting not good. testing staff expect that all card what ever they receiev shuld be 100% ok. they straight forward complain
Electronics Forum | Thu Oct 07 06:16:18 EDT 1999 | Ken Fong
Hi, We are using mixed technology in our PCBA. Would like to know whether there is any criteria governing/guiding the use of mixed technology in such aspects as: 1. Some SMDs cannot be used in some kind of PCB materials such as FR1? 2. Some SMDs are
Electronics Forum | Fri May 08 20:59:21 EDT 2009 | kareal
Davef, do you have some information about your mention "tin was used to protect copper trace ans will be removed"? It is very important for my project. Because we are assy and test plant, no any information from PCB vendor. Thanks!
Electronics Forum | Thu May 07 07:17:45 EDT 2009 | kareal
any other suggestion for it?
Electronics Forum | Fri May 08 21:53:07 EDT 2009 | kareal
X-section image: tin layer on top of copper trace.
Electronics Forum | Sat May 09 09:40:12 EDT 2009 | davef
The whitish tin layer and the solder mask appear to be incompatible, resulting in adhesion loss.
Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef
You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.
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